Substrate IC Package Layout Design Engineer

About Etched

Etched is building hardware for frontier intelligence. We co-design chips, racks, software, and manufacturing to deliver best-in-class throughput and latency across both prefill and decode workloads. Our first products are heavily focused on inference

. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.

Job Summary

As a Substrate IC Package Layout Design Engineer you will be responsible for the end-to-end design of complex IC substrate packages, supporting high-power consumption and high-speed signaling. The ideal candidate will have extensive experience with large substrate designs (>50mm), complex power delivery networks, and high-speed signaling solutions (up to and beyond 50GHz). You will work closely with silicon, signal integrity, power integrity, and system help co-design world class substates with OSAT providers.

Intense focus on optimization for power delivery through substrate, pushing what’s possible.

Key Responsibilities

• IC Substrate Layout Design
• Lead the design and development of complex IC substrate layouts for high-power AI processors and accelerators.
• Design large (>50mm) and complex multi-layer substrate packages with high pin counts and dense routing requirements.
• Ensure robust power delivery designs capable of supporting >700W custom silicon solutions.
• High-Speed Signal Routing & Integrity
• Develop high-speed signal routing solutions capable of supporting >50GHz signaling while minimizing signal integrity issues such as loss and crosstalk.
• Collaborate with SI/PI engineers to define signal integrity and power integrity requirements and implement solutions in substrate layout.
• Advanced Packaging & CoWoS Integration
• Optimize CoWoS (Chip-on-Wafer-on-Substrate) interposer designs for thermal and electrical performance.
• Work closely with chip design, packaging, and manufacturing teams to ensure design feasibility and manufacturability.
• Design Validation & Verification
• Perform DRC (Design Rule Check) and LVS (Layout vs. Schematic) verification for all substrate designs.
• Develop and maintain design documentation and guidelines for future substrate designs.
• Support design reviews and provide technical guidance to junior team members.
• You may be a good fit if you have
• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
• 10+ years of experience in IC substrate layout design for high-performance processors or accelerators.
• Extensive experience with large substrate packages (>50mm) and complex high-density layouts.
• Proven experience with high-power (700W+) package designs and robust power delivery networks.
• Expertise in high-speed signaling design (>50GHz) and mitigating signal integrity challenges (crosstalk, reflections, impedance mismatches).
• Strong experience with CoWoS (Chip-on-Wafer-on-Substrate) interposer design and the impact of the substrate design to support CoWos.
• Advanced proficiency in Allegro Package Designer (including constraint management, routing, and design verification).
• Deep understanding of SI/PI principles and how they apply to package-level design.
• Strong analytical skills and ability to work effectively in a fast-paced, cross-functional team environment.