​​Wafer Fab Technician – Metallization, Dry Etch & Wet Etch​

Location: Rowland, CA (Onsite)

Position Summary:

The Wafer Fab Process Technician serves as a key production and technical leader whose primary responsibility is running volume production in support of daily wafer fabrication schedules, while also ensuring process stability, recipe control, and yield performance across InP photonic device lines, specifically InP Buried Heterostructure (BH) DFB lasers and BH Gain Chips (GC).

The majority of this role’s hands-on time is spent operating the metallization module (e-beam evaporation and/or sputter deposition systems, lift-off processing, and contact alloy) to keep volume production lots moving on schedule, with additional ownership of dry etch and wet etch steps, including contact opening and surface preparation, that support formation of low-resistance p- and n-type ohmic contacts on finished buried heterostructure devices.

Operating with minimal supervision in a III-V cleanroom environment, the Technician plays a vital role in meeting fab throughput targets, leading root-cause investigations for process excursions, maintaining strict Process-of-Record (POR) discipline, and mentoring junior technicians and operators to support reliable, high-yield, high-volume manufacturing.

Responsibilities:

• Metallization, Dry Etch & Wet Etch Production Operations (50%): Serve as the primary production technician for the metallization module, keeping InP BH DFB laser and BH GC wafer lots moving through volume production on schedule
• Operate e-beam evaporation and/or sputter deposition systems to deposit p- and n-contact metal stacks (e.g., Ti/Pt/Au and Au-based n-contact metals), maintaining film thickness, deposition rate, and uniformity within specification for every lot
• Execute lift-off, metal etch, and solvent resist strip processes, and operate rapid thermal anneal (RTA) or furnace systems for ohmic contact alloy, maintaining metal adhesion, edge definition, and contact quality
• Operate ICP/RIE and plasma descum/ash systems for contact window opening in dielectric layers and resist residue removal ahead of metal deposition
• Execute wet etch and wet bench steps, including BOE oxide removal and pre-metal surface cleans, and maintain bench chemistry through scheduled bath changes and concentration checks
• Perform source loading, crucible and target management, chamber pump-down, and scheduled preventive maintenance tasks on deposition tools, and qualify tools with monitor wafers prior to returning them to production
• Prioritize and sequence hot lots, engineering wafers, and standard production lots across the metallization and etch bays to sustain high tool utilization and meet daily/weekly throughput targets
• Perform in-line metal thickness, sheet resistance, contact resistance (TLM), adhesion, and defect inspection and first-wafer/first-lot qualification checks prior to releasing lots downstream
• Troubleshoot routine metallization, dry etch, and wet bench tool and process issues in real time to minimize downtime and protect production schedule adherence
• Advanced Process Troubleshooting & Root Cause (20%): Lead root-cause investigation for process excursions and drift across assigned process modules (e.g., metal thickness non-uniformity, contact resistance shift, lift-off defects, adhesion failures, dry etch rate drift)
• Design and run targeted process checks (short-loop wafers, engineering splits) to isolate root cause
• Partner with Process Engineering and Equipment Engineering on corrective action design and verification
• Process Control & SPC Ownership (20%): Own SPC control charts and control-limit reviews for assigned process area, including metal thickness, sheet resistance, contact resistance, and dry/wet etch rate and depth metrics
• Own and maintain process recipes and POR documentation for assigned process area, with emphasis on metal deposition, lift-off, and contact alloy recipes
• Evaluate and implement engineering-approved recipe changes; verify post-change process stability
• Support qualification of new or modified process steps, including new metal stacks and source or target changes
• DOE, Qualification & Training Support (10%): Support execution of DOEs, process qualifications, and NPI process runs
• Train and mentor Operators on metallization, dry etch, and wet etch production operation, precious metal handling, process control methods, and troubleshooting technique

Minimum Qualifications:

• Associate degree in electronics, chemistry, materials science, or related technical field preferred; equivalent experience considered
• 5 - 10 years of experience in semiconductor/photonics wafer processing, with direct III-V/InP process experience
• Direct, hands-on experience operating e-beam evaporation and/or sputter deposition systems in a high-volume production environment strongly preferred
• Hands-on dry etch and wet etch/wet bench experience on III-V materials and dielectrics preferred
• Strong working knowledge of metallization (e-beam evaporation, sputtering, lift-off, contact alloy), plasma dry etch, wet etch, and in-line fab process steps
• Hands-on proficiency operating deposition, etch, and metrology tools (profilometer, four-point probe, TLM test structures, microscope and defect inspection) in a volume production setting
• Working knowledge of ohmic contact formation on InP and related III-V materials, including the effect of surface preparation on contact resistance and adhesion
• Ability to independently lead complex processes of troubleshooting and root-cause investigations
• Demonstrated ability to sustain lot throughput and cycle-time targets in a high-volume metallization production area
• Strong ownership mentality and independent judgment
• Effective communication with operators, technicians, and process and equipment engineers
• Ability to mentor and train junior staff
• Ability to work in a cleanroom environment for extended periods across multiple process bays, including sustained time in the metallization bay to support volume production pace
• Ability to work around chemicals (acids, solvents), process gases, and precious metals with proper safety and material control procedures
• May require flexibility to support engineering runs or excursions outside standard shift hours
• The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.
• All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

A reasonable estimate of the pay range for this position is $25 – $36. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.

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